Experimental study of ultralow flow resistance fractal microchannel heat sinks for electronics cooling-Reference-Cited by-同舟云学术

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Experimental study of ultralow flow resistance fractal microchannel heat sinks for electronics cooling

Published:2022-09 Issue: Volume:179 Page:107723
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Ji Xinyu,Yang Xiaoping,Zhang Yuantong,Zhang Yonghai,Wei Jinjia

Funder

Fundamental Research Funds for the Central Universities

Shanxi Provincial Key Research and Development Project

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference45 articles.

1. Advanced thermal management technologies for defense electronics;Bloschock;Proc. SPIE-Int. Soc. Opt. Eng.,2012

2. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981

3. Three-dimensional laminar flow and heat transfer in a parallel array of microchannels etched on a substrate;Mlcak;Int. J. Heat Mass Tran.,2008

4. Enhancement thermodynamic performance of microchannel heat sink by using a novel multi-nozzle structure;Tran;Int. J. Heat Mass Tran.,2016

5. Effect of circular pin-fins geometry and their arrangement on heat transfer performance for laminar flow in microchannel heat sink;Vasilev;Int. J. Therm. Sci.,2021

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