Integrated Planarization Technique with Consistency in Abrasive Machining for Advanced Semiconductor Chip Fabrication-Reference-Cited by-同舟云学术

Integrated Planarization Technique with Consistency in Abrasive Machining for Advanced Semiconductor Chip Fabrication

Published:1996 Issue:1 Volume:45 Page:311-314
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Jeong Heado,Ohmori Hitoshi,Doy Toshiroh Karaki,Nakagawa Takeo

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference12 articles.

1. Davis, S. 1990, Sematech, Austin, TX, USA.

2. Arita, Y., Awaya, Y., Ohno, K., and Sato, M. 1994 Copper metallization technology for deep submicron ULSIs, MRS Bulletin, August, 68-74.

3. Joshi, R. V. 1992, New developments in ULSI metallization, 328-337. Technical proceedings of SEMI technology symposium.

4. Application of chemical mechanical polishing to the fabrication of VLSI circuit interconnections;Patrick;Journal of Electrochemical Society,1991

5. Uttecht, R., and Geffken, R. 1991, A four-level metal fully planarizied interconnect technology for dense high performance logic and SRAM applications, IEEE-UMIC Conference. 20-26.

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