Development of Chipping-Free Dicing Technology Applying Electrophoretic Deposition of Ultrafine Abrasives-Reference-Cited by-同舟云学术

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Development of Chipping-Free Dicing Technology Applying Electrophoretic Deposition of Ultrafine Abrasives

Published:1991 Issue:1 Volume:40 Page:351-354
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Ikeno J.,Tani Y.,Fukutani A.,Sato H.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference8 articles.

1. Studies on Outer-blade Slicing - Gringing Force and Wheel Wear;Matsui;Journal of JSPE,1987

2. Ferrites Precision Grinding (1st Report);Miyake;Journal of JSPE,1977

3. Takano, F., 1990, Development of Trueing Device for a Slicing Machine: Prep. of JSPE: 421-422.

4. Ultra-Precision Float Polishing Machine;Namba;Annals of the CIRP,1987

5. Numerically Controlled Elastic Emission Machining;Mori;Annals of the CIRP,1979

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Precision Machining by Dicing Blades: A Systematic Review;Machines;2023-02-09

2. High-speed observation of damage generation during ultrashort pulse laser drilling of sapphire;Optics Communications;2021-09

3. Dicing Characterization on Optical Silicon Wafer Waveguide;Applied Mechanics and Materials;2020-06

4. Analytical and experimental investigations on the mechanisms of surface generation in micro grinding;International Journal of Machine Tools and Manufacture;2020-02

5. Nano Periodic Structure Formation in 4H–SiC Crystal Using Femtosecond Laser Double-Pulses;Journal of Superhard Materials;2018-07

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