Finite-element analysis of silicon condenser microphones with corrugated diaphragms
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Computer Graphics and Computer-Aided Design,General Engineering,Analysis
Reference9 articles.
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2. A silicon condenser microphone using bond and etch-back technology;Bergqvist;Sensors and Actuators A,1994
3. Modeling of thermal and mechanical stresses in silicon microstructures;Pourahmadi;Sensors and Actuators,1990
4. Design and fabrication of silicon condenser microphone using corrugated diaphragm technique;Zou;J. Microelectromech. Systems,1996
5. Membrane fabricated with a deep single corrugation for package stress reduction and residual stress relief;Spiering;J. Micromech. Microengr.,1993
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