Author:
Shohji I,Fujiwara S,Kiyono S,Kobayashi K.F
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference8 articles.
1. Lead (Pb)-free solders for electronic packaging
2. Evaluation of Lead- Free Solder Joints in Electronic Assemblies
3. Y. Tsukada, S. Tsuchida, and Y. Mashimoto, Proc. 7th IMC 252 (1992).
4. I. Shohji, T. Yamada, and H. Kimura, Proc. 9th IMC 314 (1996).
5. Metals Handbook. vol. 8, American Society for Metals, p. 312 (1973).
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