Thickness dependent soft-breakdown phenomena of low dielectric constant thin films and corresponding activation energy

Author:

Lee Shih-Wei,Kim Hyungkun,Shi Frank G,Zhao Bin

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

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2. Vapor deposition of very low k polymer films, poly(naphthalene), poly(fluorinated naphthalene);Lang;Mater. Res. Soc. Symp. Proc.,1995

3. An integrated low resistance aluminum plug and low-k polymer dielectric for high performance 0.25μm interconnects;Dixit;1996 Symp. VLSI Technol. Digest Technical Papers,1996

4. Ultra low-k porous silicon dioxide films from a plasma process;Han;Proc. IEEE Int. Interconnect Technol. Conf.,2001

5. Characteristics of polytetrafluoroethylene thin films prepared by ionization-assisted deposition;Usui;IEICE Trans. Electron.,1998

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