Application of chitosan-based polysaccharide biomaterials in cartilage tissue engineering: a review
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Biomaterials,Biophysics,Ceramics and Composites,Bioengineering
Reference109 articles.
1. Of the structure and diseases of articulating cartilages;Hunter;Philos Trans,1743
2. Cell origin and differentiation in the repair of full-thickness defects of articular cartilage;Shapiro;J Bone Jt Surg,1993
3. Repair of partial-thickness defects in articular cartilage;Hunziker;J Bone Jt Surg,1996
4. Articular cartilage Part II;Buckwalter;J Bone Jt Surg,1997
5. Arthroscopic abrasion arthroplasty historical and pathological perspective;Johnson;Arthroscopy,1989
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