High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)-Reference-Cited by-同舟云学术

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High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)

Published:2021-08 Issue: Volume:206 Page:109830
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Lee Pei-Tzu,Chang Chih-Hao,Lee Cheng-Yu,Wu Ying-Syuan,Yang Cheng-Hsien,Ho Cheng-En

Funder

Taiwan Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference44 articles.

1. T. Aoki, E. Nakamura, S. Kohara, C. Marushima, K. Sueoka, T. Hisada, R. Yamaguchi, N. Sekine, K. Yatsugi, M. Yada, Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (2020) 742–748.

2. M. Datta, Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview, J. Micro. Nanomanuf. 3 (2020) 69–83.

3. Heat dissipation optimization and prediction for three-dimensional fan-out package;Huang;Int. J. Therm. Sci.,2021

4. High-speed Cu electrodeposition and its solderability;Lee;Surf. Coat. Tech.,2017

5. High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage;Lee;J. Electrochem. Soc.,2018

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2. Stacking Fault and Plastic Deformation Mechanism in Nano‐twinned Cu Pillar under Ultrahigh Stress;Advanced Engineering Materials;2024-07-10

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4. Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers;Nano Materials Science;2024-07

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