Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
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Elsevier BV
Reference45 articles.
1. A review: influence of nano particles reinforced on solder alloy;Ervina;Soldering Surf. Mount Technol.,2013
2. Reliability of SAC 405 and SAC 387 as lead-free solder ball material for ball grid array packages;Ahmad;Int. J. Eng. Technol.,2007
3. Surface finish effect on reliability of SAC 305 soldered chip resistors;Collins;Soldering Surf. Mount Technol.,2012
4. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014
5. Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties;Billah;J. Alloys Compd.,2014
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