Enhanced thermal transfer and bending strength of SiC/Al composite with controlled interfacial reaction
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference32 articles.
1. High volume fraction SiCp/Al composites prepared by pressureless melt infiltration: processing, properties and applications;Cui;Key Eng Mater,2003
2. Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution;Chu;J Mater Sci,2009
3. The thermal conductivity of pressure infiltrated SiCp/Al composites with various size distributions: experimental study and modeling;Chu;Mater Des,2009
4. Thermal expansion behavior of aluminum matrix composites with densely packed SiC particles;Nam;Composites Part A,2008
5. Interface formation in infiltrated Al(Si)/diamond composites;Beffort;Diamond Relat Mater,2006
Cited by 42 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Interatomic potential of the MgAl2O4/Al interface and its application in strengthening mechanisms;Journal of Materials Research and Technology;2024-09
2. Microstructure and interfacial behavior of SiCp/6061 aluminum matrix composite joined by laser welding with filled TixSi powder;Journal of Materials Science;2024-07-05
3. In-situ solid-state deformation-driven rapid reaction towards higher strength-ductility Al-CuO composites;Composites Part A: Applied Science and Manufacturing;2024-07
4. Synergistic enhancement of strength and plasticity of SiCp/Al composites by designing and controlling SiCp@MgAl2O4 core-shell micro-interfaces;Ceramics International;2023-12
5. Enhanced thermal conductivity and mechanical performance of CaO–B2O3–SiO2 glass ceramic with AlN addition for LTCC applications;Ceramics International;2023-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3