Properties and interfacial microstructure of Sn–Zn–Ga solder joint with rare earth Pr addition
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference29 articles.
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2. Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions;El-Daly;Mater Design,2012
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