Author:
Hu Lianjun,Pan Guofeng,Li Can,Zhang Xinbo,Liu Jia,He Ping,Wang Chenwei
Funder
National Research Council of Science and Technology
Natural Science Foundation of Tianjin
Natural Science of Hebei Province Colleges and Universities
Key Laboratory of Electronic Materials and Devices
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference42 articles.
1. Direct copper plating on ultra-thin sputtered cobalt film in an alkaline bath;Xu;J. Electrochem. Soc.,2013
2. Mechanism of co liner as enhancement layer for cu interconnect gap-fill;He;J. Electrochem. Soc.,2013
3. Synergetic effect of H2O2 and glycine on cobalt CMP in weakly alkaline slurry;Jiang;Microelectron. Eng.,2014
4. Optimized copper chemical mechanical polishing with CVD co barrier at 14nm technology node;Hsu,2014
5. CMP process development for cobalt liner at the 28-nm-node;Koch,2015
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献