Formation mechanism and microstructure evolution of Cu/Ti diffusion bonding interface and its influence on joint properties
Author:
Funder
Natural Science Basic Research Program of Shaanxi Province
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference39 articles.
1. Forming and tensile fracture characteristics of Ti-6Al-4V and T2 Cu vacuum electron beam welded joints;Guo;Vacuum,2019
2. Effect of Ag alloying on the microstructure and mechanical properties of laser welded-brazed Ti/Al dissimilar joints;Zhang;Mater. Sci. Eng., A,2022
3. Designing of a thin Mo diffusion barrier towards strong and reliable Ti/Cu dissimilar brazing;Deng;Mater. Sci. Eng., A,2020
4. Bond strength optimization of Ti/Cu/Ti clad composites produced by roll-bonding;Hosseini;Mater. Des.,2015
5. Experimental and numerical investigations of interface properties of Ti6Al4V/CP-Ti/Copper composite plate prepared by explosive welding;Mahmood;Def. Technol.,2021
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