Plasma characteristics and properties of Cu films prepared by high power pulsed magnetron sputtering-Reference-Cited by-同舟云学术

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Plasma characteristics and properties of Cu films prepared by high power pulsed magnetron sputtering

Published:2017-01 Issue: Volume:135 Page:93-100
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Wu B.H.,Wu J.,Jiang F.,Ma D.L.,Chen C.Z.,Sun H.,Leng Y.X.,Huang N.

Funder

NSAF

NSFC

Educational Commission of Hubei Province of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference44 articles.

1. Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD;Yu;Surf. Coatings Technol.,2006

2. Adhesion studies of CVD copper metallization;Gandikota;Microelectron. Eng.,2000

3. Influence of film density on residual stress and resistivity for Cu thin films deposited by bias sputtering;Choi;Thin Solid Films,2000

4. Abe K, Harada Y, Onoda H. Cu Damascene Interconnects with Crystallographic Texture Control and its Electromigration Performance. Proceedings of the 36th IEEE International Reliability Physics Symposium. Reno, Nevada.1998. 342–347.

5. Influence of substrate bias on the microstructure and internal stress in Cu films deposited by filtered cathodic vacuum arc;Cheng;J. Vac. Sci. Technol. A Vac. Surfaces, Films,2001

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