Structural and electrical investigations of silicon wafer bonding interfaces-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Structural and electrical investigations of silicon wafer bonding interfaces

Published:1996-12 Issue:1-3 Volume:42 Page:164-167
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Benamara Mourad,Rocher André,Sopéna Pierre,Claverie Alain,Laporte Angéline,Sarrabayrouse Gérard,Lescouzères Lionel,Peyre-Lavigne André

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. Solid state phenomena;Gösele,1995

2. 7th Int. Symp Power Semiconductor Devices and ICs;Laporte,1995

3. Quantitative SEM/BIC studies of carrier recombination in silicon bicrystals

4. Proc. 2nd Int. Symp. Semiconductor Wafer Bonding;Macary,1993

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Spatial arrangements and types of dislocations in interfacial networks obtained by Si(001) wafer bonding at low twist angle: A TEM characterization;Materials Science in Semiconductor Processing;2024-12

2. Ion Beam-Mediated Defect Engineering in TiOx Thin Films for Controlled Resistive Switching Property and Application;ACS Applied Electronic Materials;2021-08-17

3. Impact of Various Charge States of Hydrogen on Passivation of Dislocation in Silicon;Electronic Materials Letters;2018-03-28

4. Grain Boundaries in Semiconductors;Materials Science and Technology;2013-02-15

5. Direct Wafer Bonding;Handbook of Wafer Bonding;2012-02-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP