Effect of fiber diameter and orientation on fibroblast morphology and proliferation on electrospun poly(d,l-lactic-co-glycolic acid) meshes
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Biomaterials,Biophysics,Ceramics and Composites,Bioengineering
Reference44 articles.
1. Anterior cruciate ligament healing and repair;Murray;Sports Med Arthroscopy Rev,2005
2. Fiber-based tissue-engineered scaffold for ligament replacement: design considerations and in vitro evaluation;Cooper;Biomaterials,2005
3. Reconstruction of the anterior cruciate ligament: meta-analysis of patellar tendon versus hamstring tendon autograft;Goldblatt;J Arthroscopic Rel Surg,2005
4. Tissue engineering of ligaments;Vunjak-Novakovic;Ann Rev Biomed Eng,2004
5. Analysis of retrieved polymer fiber based replacements for the ACL;Guidoin;Biomaterials,2000
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