An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additive
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
Reference36 articles.
1. Effect of Crystal Plane on the Mechanism and the Kinetics of Copper Electrocrystallization
2. Silver electrocrystallization—a model for partial activity
3. Atomic-Resolution Microscopy in Water
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