1. Cell-level placement for improving substrate thermal distribution;Tsai;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,2000
2. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Letters,1981
3. Direct liquid cooling of microelectronic components;Bergles,1990
4. Single chamber compact thermosyphons with micro-fabricated components;Murthy,2000
5. The use of heat pipes in personal computers;Xie,1998