Vacuum packaging for microsensors by glass-silicon anodic bonding-Reference-Cited by-同舟云学术

Vacuum packaging for microsensors by glass-silicon anodic bonding

Published:1994-05 Issue:1-3 Volume:43 Page:243-248
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Henmi H.,Shoji S.,Shoji Y.,Yoshimi K.,Esashi M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Anodic bonding for integrated capacitive sensors;Esashi;Proc. MEMS '92, Travemunde, Germany,1992

2. An ultraminiature silicon pressure sensors;Steve;IEEE Trans. Electron Devices,1992

3. N. Ura, K. Nakaichi, K. Minami and M. Esashi, Vacuum sealing with anodic bonding, Proc. 11th Japanese Sensor Symp., Tokyo, Japan, June 4–5, 1992, p. 63

4. Alloying effect on the activation processes of Zr-alloy getters;Ichimura;J. Vac. Sci. Technol.,1987

5. K. Yoshimi, K. Minami, Y. Wakabayashi and M. Esashi, Packaging of resonant sensors, Tech. Digest, 11th Sensor Symp., Tokyo, Japan, June 4–5, 1992, pp. 35–38

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