Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating-Reference-Cited by-同舟云学术

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Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating

Published:2014-11 Issue: Volume:259 Page:98-101
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Park Jae-Hyung,Moon Dae-Yong,Han Dong-Suk,Kang Yu-Jin,Shin So-Ra,Jeon Hyung-Tag,Park Jong-Wan

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference20 articles.

1. International Technology Roadmap for Semiconductors (Edition 2009, Interconnect, 2009).

2. Atomic Layer Deposition of Ultrathin Copper Metal Films from a Liquid Copper(I) Amidinate Precursor

3. The application of atomic layer deposition for metallization of 65 nm and beyond

4. Comparison of the diffusion barrier properties of chemical‐vapor‐deposited TaN and sputtered TaN between Cu and Si

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1. Mechanistic study of the atomic layer deposition of cobalt: a combined mass spectrometric and computational approach;Physical Chemistry Chemical Physics;2024

2. Atomic Layer Deposition of Cobalt Film from Dicobalt-hexacarbonyl-tert-butylacetylene and Hydrogen;ECS Journal of Solid State Science and Technology;2023-11-01

3. Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor;Beilstein Journal of Nanotechnology;2023-09-15

4. Atomic layer deposition of thin films: from a chemistry perspective;International Journal of Extreme Manufacturing;2023-06-14

5. Self‐Formation of a Ru/ZnO Multifunctional Bilayer for the Next‐Generation Interconnect Technology via Area‐Selective Atomic Layer Deposition;Small;2023-05

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