The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior-Reference-Cited by-同舟云学术

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The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior

Published:2023-03 Issue: Volume:456 Page:129252
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Chao Jui-Lin,Lin Si-Wei,Lin Jing-Chie,Liu Yi-Hung,Hsiao Chih-Yuan,Wang Freeze,Li Nico,Wu Albert T.

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference31 articles.

1. A comparison of alloy-surface finish combinations considering different component package types and their impact on soldering reliability;Berni;IEEE Trans. Reliab.,2015

2. The roles of plasma science towards plasma-activated reflow soldering on Cu substrate with organic solderability preservatives surface finish;Kencana;Surf.Interfaces,2022

3. Oxidation kinetics of thin copper films and wetting behaviour of copper and organic solderability preservatives (OSP) with lead-free solder;Ramirez;Appl. Surf. Sci.,2011

4. Microstructural characteristics of immersion tin coatings on copper circuitries in circuit boards;Chen;Surf. Coat. Technol.,2007

5. Tin whiskers' behavior under stress load and the mitigation method for immersion tin surface finish;Fadil;Materials,2021

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