Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference66 articles.
1. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—state of the art;Grill;Appl. Phys. Rev.,2014
2. B.N. Varadarajan, B. Gong, Z. Gui, Conformal deposition of silicon carbide films, United States Patent Application Publication US 2015/0303056 Al, 2015.
3. B.N. Varadarajan, Method to obtain SiC class of films of desired composition and film properties, United States Patent Application Publication US 9,234,276 B2, 2016.
4. Molecular self-assembled monolayers and multilayers for organic and unconventional inorganic thin-film transistor applications;D.;Adv. Mater.,2009
5. Low-k a-SiCO:H films as diffusion barriers for advanced interconnects;Van Besien;Microelectron. Eng.,2014
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