Some issues for microsystem packaging in plastic and 3D-Reference-Cited by-同舟云学术

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Some issues for microsystem packaging in plastic and 3D

Published:1998-09 Issue:9 Volume:29 Page:645-650
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Morrissey A.,Kelly G.,Alderman J.,Barrett J.,Lyden C.,O'Rourke L.

Publisher

Elsevier BV

Subject

General Engineering

Reference17 articles.

1. Microsystem technologies '96;Catanescu,1996

2. Packaging of microsensors;Ko,1994

3. Microsystem packaging: Lessons from conventional low cost IC packaging;Kelly,1996

4. The 3D interconnection — Applications for mass memory and microprocessors;Val,1991

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flexible printed circuit boards laser bonding using a laser beam homogenization process;Optics and Lasers in Engineering;2012-11

2. Microsystem Packaging in Plastic and in 3D;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999

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