Facile chemical surface modification of boron nitride platelets and improved thermal and mechanical properties of their polymer compounds for 2.5D/3D packaging applications-Reference-Cited by-同舟云学术

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Facile chemical surface modification of boron nitride platelets and improved thermal and mechanical properties of their polymer compounds for 2.5D/3D packaging applications

Published:2024-09 Issue: Volume:256 Page:110778
ISSN:0266-3538
Container-title:Composites Science and Technology
language:en
Short-container-title:Composites Science and Technology

Author:

Lin Zihao,Li Jiaxiong,Sun Zhijian,Fang Andrew D.,Han Keyi^ORCID,Jia Shu,Liu Yao-Hao,Adams Michael J.,Moon Kyoung-sik,Wong Ching-Ping

Publisher

Elsevier BV

Reference53 articles.

1. Emerging challenges and materials for thermal management of electronics, Mater;Moore;Today Off.,2014

2. Physical design automation for 3D chip stacks: challenges and solutions;Knechtel,2016

3. On-chip cooling by superlattice-based thin-film thermoelectrics;Chowdhury;Nat. Nanotechnol.,2009

4. Boron nitride filled epoxy with improved thermal conductivity and dielectric breakdown strength;Donnay;Compos. Sci. Technol.,2015

5. Emerging monolithic 3D integration: opportunities and challenges from the computer system perspective;Cheng;Intégral,2022

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