Electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe solder alloys in NaCl solution
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference56 articles.
1. Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition;Xiao;J. Mater. Sci. Mater. Electron.,2023
2. Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solder joints;Ren;Mater. Charact.,2023
3. The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys;Ren;Mater. Des.,2017
4. Hypo-eutectic microstructure formation and nanomechanical response in Sn-3.0Ag-0.5Cu solder balls: effects of undercooling;Wang;Mater. Charact.,2023
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2. Corrosion mechanisms of 316L stainless steel in polyphosphoric acid at elevated temperature: Behavior and mechanistic insights;Corrosion Science;2024-08
3. The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance;Soldering & Surface Mount Technology;2024-04-17
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