Prospective development in diffusion barrier layers for copper metallization in LSI
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference41 articles.
1. C.Y. Chang, S.M. Sze, ULSI Technology, McGraw-Hill, 1996
2. Handbook of Multilevel Metallization for Integrated Circuits: Noyes Publications;Wilson,1993
3. Microelectronic Materials;Grovenor,1998
4. Diffusion barriers in thin films
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