A novel diffusion barrier of electrodeposited CoWP layer between copper and silicon: Preparation and performance-Reference-Cited by-同舟云学术

A novel diffusion barrier of electrodeposited CoWP layer between copper and silicon: Preparation and performance

Published:2022-06 Issue: Volume:30 Page:101925
ISSN:2468-0230
Container-title:Surfaces and Interfaces
language:en
Short-container-title:Surfaces and Interfaces

Author:

Hu Zhengyan,Ren Li,Zhao Kangning,Wei Guoying^ORCID,Zhang Zhongquan,Han Tao,Zhong Fengping,Yuan Meng^ORCID

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Condensed Matter Physics,Surfaces and Interfaces,General Chemistry

Reference26 articles.

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5. Oxidation resistance of graphene-coated Cu and Cu/Ni alloy;Chen;ACS Nano,2011

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