A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis
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Elsevier BV
Reference69 articles.
1. A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging;Miao;Microelectron. J.,2022
2. Machine learning enables accurate wire loop profile prediction for advanced microelectronics packaging;Hou;J. Manuf. Process,2022
3. Co, In, and Co–In alloyed Cu6Sn5 interconnects: microstructural and mechanical characteristics. Materials science & engineering. A, structural materials: properties;Emadi;Microstruct. Process.,2023
4. Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration;Ji;Microelectron. Reliab.,2023
5. A lightweight convolutional neural network for recognition and classification for Si3N4 chip substrate surface defects;Dahai;Ceram. Int.,2023
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