Numerical analysis of mono and hybrid nanofluids-cooled micro finned heat sink for electronics cooling-(Part-I)-Reference-Cited by-同舟云学术

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Numerical analysis of mono and hybrid nanofluids-cooled micro finned heat sink for electronics cooling-(Part-I)

Published:2024-08 Issue: Volume:23 Page:100810
ISSN:2666-2027
Container-title:International Journal of Thermofluids
language:en
Short-container-title:International Journal of Thermofluids

Author:

Arshad Adeel^ORCID,Ikhlaq Muhammad,Saeed Muhammad,Imran Muhammad

Publisher

Elsevier BV

Reference47 articles.

1. Liquid cooling of data centers: a necessity facing challenges;Azarifar;Appl. Therm. Eng.,2024

2. Reliability and Failure of Electronic Materials and Devices;Ohring,2014

3. Numerical study on thermal hydraulic performance of water cooled mini-channel heat sinks;Saeed;Int. J. Refrig.,2016

4. Header design approaches for mini-channel heatsinks using analytical and numerical methods;Saeed;Appl. Therm. Eng.,2017

5. A comparison of the heat transfer performance and pressure drop of nanofluid-cooled heat sinks with different miniature pin fin configurations;Duangthongsuk;Exp. Therm. Fluid Sci.,2015

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