Molecular dynamics studies of helium bubble effects on grain boundary fracture vulnerabilities in an Fe70Ni11Cr19–1%H austenitic stainless steel
Author:
Funder
Sandia National Laboratories
Publisher
Elsevier BV
Subject
Nuclear Energy and Engineering,General Materials Science,Nuclear and High Energy Physics
Reference48 articles.
1. Introductory remarks: helium in metals;Ullmaier;Radiat. Eff.,1983
2. The influence of helium on the bulk properties of fusion reactor structural materials;Ullmaier;Nucl. Fus.,1984
3. Accelerated fracture due to tritium and helium in 21-6-9 stainless steel;Robinson;Metall. Trans. A,1991
4. Neutron /proton irradiation and He effects on the microstructure and mechanical properties of ferritic / martensitic steels T91 and EM10;Dai;J. Nucl. Mater.,2011
5. Correlation between embrittlement and bubble microstructure in helium-implanted materials;Yamamoto;J. Nucl. Mater.,2004
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