On the fatigue of solder subjected to isothermal cyclic shear-Reference-Cited by-同舟云学术

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On the fatigue of solder subjected to isothermal cyclic shear

Published:1993-02 Issue:3 Volume:28 Page:349-353
ISSN:0956-716X
Container-title:Scripta Metallurgica et Materialia
language:en
Short-container-title:Scripta Metallurgica et Materialia

Author:

Rynemark Maria,Nylén Margareta,Hutchinson Bevis

Publisher

Elsevier BV

Subject

General Engineering

Reference13 articles.

1. Electronic packaging Materials and Processes;Solomon,1985

2. Isothermal Fatigue Behavior of Sn-Pb Solder Joints

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure dependent viscoplastic damage modelling of tin–lead solder;Journal of the Mechanics and Physics of Solids;2006-12

2. Effects of gap filler and brazing temperature on fracture and fatigue of wide-gap brazed joints;Journal of Materials Science;1995-04

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