Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI-Reference-Cited by-同舟云学术

Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI

Published:2020-03 Issue: Volume:505 Page:144507
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Zhou Jiakai,Niu Xinhuan,Cui Yaqi,Wang Zhi,Wang Jianchao,Wang Ru

Funder

Major National Science and Technology Special Projects

Natural Science Foundation of Tianjin China

Science and Technology Planning Project of Tangshan

Key Laboratory of Electronic Materials and Devices of Tianjin

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference34 articles.

1. Inhibition mechanism of benzotriazole in copper chemical mechanical planarization;Li;Appl. Mech. Mater.,2014

2. Evaluating the large electromigration resistance of copper interconnects employing a newly developed accelerated life- test method;Nitta;J. Electrochem. Soc.,1993

3. Chemical processes in the chemical mechanical polishing of copper;Steigerwald;Mater. Chem. Phys.,1995

4. Functions of Trilon® P as a polyamine in copper chemical mechanical polishing;Jiang;Appl. Surf. Sci.,2014

5. Parshuram B. Zantye, Ashok Kumar, A.K. Sikder, Chemical mechanical planarization for microelectronics applications, Mater. Sci. Eng. 45 (2004) 89–220. https://doi.org/10.1016/j.mser.2004.06.002.

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