Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism
Author:
Funder
National Natural Science Foundation of China
Key Laboratory of Photovoltaic and Energy Conservation Materials CAS
Anhui Provincial Natural Science Foundation
Publisher
Elsevier BV
Reference54 articles.
1. Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives;Liu;Appl. Surf. Sci.,2023
2. A novel slurry for chemical mechanical polishing of single crystal diamond;Liao;Appl. Surf. Sci.,2021
3. Green chemical mechanical polishing of sapphire wafers using a novel slurry;Xie;Nanoscale,2020
4. Study on material removal mechanism of sapphire wafer with CeO2 coated diamond composite abrasives via green polishing;Xu;J. Manuf. Process.,2023
5. Atomic surface of fused silica and polishing mechanism interpreted by molecular dynamics and density functional theory;Liu;Mater. Today Sustain.,2023
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