Selective dry etching of TiAlC over TiN using nonhalogen N2/H2 plasma

Author:

Nguyen Thi-Thuy-NgaORCID,Shinoda KazunoriORCID,Hsiao Shih-NanORCID,Maeda Kenji,Yokogawa Kenetsu,Izawa Masaru,Ishikawa Kenji,Hori Masaru

Funder

Nagoya University

Publisher

Elsevier BV

Reference65 articles.

1. Investigation of TiAlC by Atomic Layer Deposition as N Type Work Function Metal for FinFET;Xiang;ECS J. Solid State Sci. Technol.,2015

2. Variable work function in MOS capacitors utilizing nitrogen-controlled TiNx gate electrodes;Westlinder;Microelectron. Eng.,2004

3. Metal gate work function tuning by Al incorporation in TiN;Lima;J. Appl. Phys.,2014

4. Tunable Work-Function Engineering of TiC–TiN Compound by Atomic Layer Deposition for Metal Gate Applications;Jeon;J. Electrochem. Soc.,2010

5. G. Nowling, J. Foster, Etching of semiconductor structures that include titanium-based layers, U.S. Patent No. 9330937B2, 2013. https://patents.google.com/patent/US9330937B2/en (accessed October 13, 2021).

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