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Growing hydrophobicity on a smooth copper oxide thin film at room temperature and reversible wettability transition

  • Published:2014-10 Issue: Volume:316 Page:88-92
  • ISSN:0169-4332
  • Container-title:Applied Surface Science
  • language:en
  • Short-container-title:Applied Surface Science

Author:

Tu Sheng-Hung,Wu Hsing-Chen,Wu Cyuan-Jhang,Cheng Shao-Liang,Sheng Yu-Jane,Tsao Heng-Kwong

Funder

Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference17 articles.

1. International Technology Roadmap For Semiconductors;Semiconductor Industry Association,1999

2. Post etch cleaning of low-k dielectric materials for advanced interconnects: characterization and process optimization;Louis;Microelectron. Eng.,1998

3. The future of interconnection technology;Theis;IBM J. Res. Dev.,2000

4. The evolution of silicon wafer cleaning technology;Kern;J. Electrochem. Soc.,1990

5. A novel method of etching copper oxide using acetic acid;Chavez;Electrochem. Soc.,2001
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