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Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding

  • Published:2013-02 Issue: Volume:65 Page:68-78
  • ISSN:0890-6955
  • Container-title:International Journal of Machine Tools and Manufacture
  • language:en
  • Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Agarwal Sanjay,Venkateswara Rao P.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference44 articles.

1. A fracture mechanics approach to modeling strength degradation in ceramic grinding processes;Hu;Transactions of ASME, Journal of Engineering for Industry,1973

2. Optimization of grinding of silicon carbide with diamond wheels using genetic algorithms;Gopal;International Journal of Advanced Manufacturing Technology,2003

3. Modeling and simulation of grinding processes;Tonshoff;Annals of the CIRP,1992

4. Practical significance of contact deflections in grinding;Saini;Annals of the CIR,1982

5. Mechanisms of material removal in abrasive machining of ceramics;Jahanmir,1999

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