Funder
National Research Foundation of Korea
Sun Moon University
Korea Science and Engineering Foundation
Reference26 articles.
1. Recent advances in passive immersion cooling of high power devices;Bar-Cohen,1997
2. Liquid-cooling of electronic equipment: where does it offer viable solutions?;Nakayama,1997
3. Electronic packaging in the 1990’s—a perspective from America;Tummala;IEEE Comp. Hybrids Manuf. Technol.,1991
4. Electronic packaging in the 1990’s—a perspective from Asia;Ohsaki;IEEE Comp. Hybrids Manuf. Technol.,1991
5. State-of-the-art multichip modules for avionics;Hagge;IEEE Comp. Hybrids Manuf. Technol.,1992
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