Stabilization effect of electroless nickel plating by thiourea-Reference-Cited by-同舟云学术

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Stabilization effect of electroless nickel plating by thiourea

Published:1997-02 Issue:2 Volume:95 Page:73-75
ISSN:0026-0576
Container-title:Metal Finishing
language:en
Short-container-title:Metal Finishing

Author:

Keping Han,Fang Jing Li

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Polymers and Plastics,Pollution,Waste Management and Disposal

Reference21 articles.

1. Anionic Inhibition in Electroless Plating

2. Electroless Plating: Fundamentals and Applications;Hajdu,1990

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Medium and High Phosphorous Ni-P Coatings Obtained via an Electroless Approach: Optimization of Solution Formulation and Characterization of Coatings;Coatings;2023-08-24

2. Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications;Micromachines;2023-05-29

3. The influence of iodate ion additions to the bath on the deposition of electroless nickel on mild steel;Transactions of the IMF;2018-09-03

4. Impact Parameters and Deposition Rate;Amorphous and Nano Alloys Electroless Depositions;2016

5. Parameter optimization for electroless Ni–W–P coating;Surface and Coatings Technology;2015-08

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