Effects of ligands on electroless Ni–P alloy plating from alkaline citrate–ammonia solution-Reference-Cited by-同舟云学术

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Effects of ligands on electroless Ni–P alloy plating from alkaline citrate–ammonia solution

Published:2003-05 Issue:2-3 Volume:168 Page:300-306
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Wang Xu-Cheng,Cai Wen-Bin,Wang Wei-Jiang,Liu Hou-Tian,Yu Zu-Zhan

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference24 articles.

1. S. Jung, T.M. Devine, The 202nd Electrochemical Society Meeting, Meeting Abstracts, Salt Lake City, Utah, 2002, G1-258

2. Deposition of nickel and cobalt by chemical reduction

3. Electroless Plating;Mallory,1990

4. New Techniques in Electroless Nickel and Composite Plating;Yan,2001

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