Author:
Brinckmann Steffen,Soler Rafael,Dehm Gerhard
Subject
General Materials Science
Reference32 articles.
1. Measurement of adherence of residually stressed thin films by indentation. i. Mechanics of interface delamination;Marshall;J. Appl. Phys.,1984
2. Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W;Kriese;J. Mater. Res.-Pittsburgh,1999
3. A brittle to ductile transition (bdt) in adhered thin films;Gerberich,2000
4. A new procedure for measuring the decohesion energy for thin ductile films on substrates;Bagchi;J. Mater. Res.,1994
5. Q. Ma, H. Fujimoto, P. Flinn, V. Jain, F. Adibi-Rizi, F. Moghadam, R.H. Dauskardt, Quantitative measurement of interface fracture, 391.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献