Triple-functional bone adhesive with enhanced internal fixation, bacteriostasis and osteoinductive properties for open fracture repair
Author:
Publisher
Elsevier BV
Subject
Biomedical Engineering,Biomaterials,Biotechnology
Reference72 articles.
1. [Open fractures];Omar;Unfallchirurg,2021
2. Risk factors for infectious complications after open fractures; a systematic review and meta-analysis;Kortram;Int. Orthop.,2017
3. The principles and practice of open fracture care;Diwan;Chin. J. Traumatol.,2018
4. A reevaluation of the risk of infection based on time to debridement in open fractures: results of the GOLIATH meta-analysis of observational studies and limited trial data;Foote;J Bone Joint Surg Am,2021
5. Prevention of infection in open fractures;Zalavras;Infect. Dis. Clin.,2017
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