Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes-Reference-Cited by-同舟云学术

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Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes

Published:2019-07 Issue: Volume:100 Page:262-268
ISSN:1876-1070
Container-title:Journal of the Taiwan Institute of Chemical Engineers
language:en
Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Li Jiujuan,Zhou Guoyun,Wang Jinzhong,Hong Yan,He Wei,Wang Shouxu,Wang Chong,Chen Yuanming,Yang Wenjun,Ma Chaoying,Miao Hua,Zhou Jinqun,Chen Qingguo

Publisher

Elsevier BV

Subject

General Chemical Engineering,General Chemistry

Reference42 articles.

1. Improved uniformity of conformal through-hole copper electrodeposition by revision of plating cell configuration;Ji;J Electrochem Soc,2015

2. Copper electrodeposition for nanofabrication of electronics devices;Akolkar,2014

3. Effects of supporting electrolytes on copper electroplating for filling through-hole;Chen;Electrochim Acta,2011

4. Copper electroplating of PCB interconnects using megasonic acoustic streaming;Jones;Ultrason Sonochem,2018

5. An investigation of supercritical-CO2 copper electroplating parameters for application in TSV chips;Chuang;J Micromech Microeng,2015

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Numerical and experimental investigation of 2-thiazoline-2-thiol and nitrotetrazolium blue chloride compound as levelers for through-hole copper electroplating;Materials Today Communications;2024-08

2. Conductive polyaniline film synthesized through in-situ polymerization as a conductive seed layer for hole metallization of printed circuit boards;Applied Surface Science;2024-05

3. Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications;ACS Omega;2024-03-14

4. Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model;Journal of the Taiwan Institute of Chemical Engineers;2024-03

5. Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture;REVIEWS ON ADVANCED MATERIALS SCIENCE;2024-01-01

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