Studies on thermal stability, softening behavior and mechanism of an ADS copper alloy at elevated temperatures
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference61 articles.
1. Development of copper wire bonding application technology
2. Surface characterization and corrosion behavior of 70/30 Cu–Ni alloy in pristine and sulfide-containing simulated seawater
3. Precipitation in Cu–Ni–Si–Zn alloy for lead frame
4. Mechanical properties of a high strength Cu–Ta composite at elevated temperature
5. A review study on thermal stability of high entropy alloys: Normal/abnormal resistance of grain growth
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of nano-scaled Al2O3 particles on dynamic recrystallization behavior and microstructure evolution of pure copper in hot deformation;Materials Science and Engineering: A;2024-11
2. Microstructural evolution and modified constitutive model of nanoscale Al2O3 dispersion-strengthened copper under high strain rate deformation;Materials Science and Engineering: A;2024-10
3. Preparation and microstructure of Cu-Al2O3 composites by a novel supercritical water liquid phase in-situ reaction method;Materials Today Communications;2024-06
4. Effect of Trace Silver on the Conductivity and Softening Resistance of High Conductivity and High Heat Resistance Pure Copper;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3