Author:
WANG Kai-kun,KANG Yong-lin,SONG Pu-guang,XU Feng,LI Xian-hui
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference14 articles.
1. High performance packaging materials and architectures for improved thermal management of power electronics [J];MOORES;Future Circuits Int,2001
2. Two–phase simulation and visualization of isothermal die filling processes [C];MODIGELL,2002
3. Advanced Materials for Optoelectronic Packaging [J];ZWEBEN;Optoelectronics,2002
4. Analysis of the rheological behavior and stability of 316L, stainless steel-TiC powder injection molding feedstock [J];KHAKBIZ;Materials Science and Engineering A,2005
5. Materials forming and joining of commercial steel grades in the semi-solid state [J];KOPP;Processing Technology,2002
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献