Effect of La on the Cu–Sn intermetallic compound (IMC) growth and solder joint reliability
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference19 articles.
1. Kinetics of interfacial reaction in bimetallic CuSn thin films
2. The growth of Cu-Sn intermetallics at a pretinned copper-solder interface
3. Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
4. Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints
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