Effect of ageing conditions on the low velocity impact behavior and damage characteristics of aramid-basalt/epoxy hybrid interply composites
Author:
Publisher
Elsevier BV
Subject
General Engineering,General Materials Science
Reference61 articles.
1. Influence of fabric orientation and compression factor on the mechanical properties of 3D E-glass reinforced epoxy composites;Nayak;J. Mater. Res. Technol.,2020
2. Experimental and numerical study on the low-velocity impact behavior of foam-core sandwich panels;Wang;Compos. Struct.,2013
3. Moisture absorption and wet-adhesion properties of resin transfer molded (RTM) composites containing elastomer-coated glass fibers;Barraza;J. Adhes. Sci. Technol.,2003
4. ScienceDirect advances and researches on non destructive testing: a review;Kumar;Mater. Today:. Proc.,2018
5. The dynamics of impact on composite structures;Abrate;Key Eng. Mater.,2016
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Interface engineering via non-thermal atmospheric plasma for highly tensile insulating epoxy-impregnated aramid composite paper;Composites Science and Technology;2024-10
2. Fracture behaviour analysis of sustainable basalt-reinforced polymer composites subjected to thermal cycling and open holes;Engineering Failure Analysis;2024-09
3. Understanding and Addressing Multi-faceted Failures in Building Structures;Journal of Failure Analysis and Prevention;2024-08
4. Systematic literature review on the design, efficiency and fabrication of wind turbine blades;International Journal of Ambient Energy;2024-07-22
5. Impact response of hybrid composites under varying environmental conditions: A comparative study;Polymer Composites;2024-06-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3