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Analogy between heat and moisture

Published:2000-06 Issue:1-3 Volume:76 Page:145-152
ISSN:0045-7949
Container-title:Computers & Structures
language:en
Short-container-title:Computers & Structures

Author:

Szekeres A.

Publisher

Elsevier BV

Subject

Computer Science Applications,Mechanical Engineering,General Materials Science,Modelling and Simulation,Civil and Structural Engineering

Reference16 articles.

1. Coupled thermal and moisture fields with application to composites;Szekeres;Periodica Polytechnica, Ser. Mech. Eng,1997

2. Similarities and differences between heat conduction and moisture diffusion;Szekeres,1997

3. Coupled stress distribution in a vibrating rod subjected to variable temperature and moisture;Heller,1997

4. Bosnjakovic F. Technische Thermodynamik, Verlag Theodor Steinkopff, Dresden und Leipzig, 1965

5. Hygrothermoelasticity;Sih,1986

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