Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon-Reference-Cited by-同舟云学术

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Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon

Published:2004-10 Issue:7-8 Volume:257 Page:751-759
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Sharif Uddin M.,Seah K.H.W.,Li X.P.,Rahman M.,Liu K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference28 articles.

1. Ultra-precision metal cutting—the past, the present and the future;Iwaka;Ann. CIRP,1991

2. Technology of diamond tool for ultra-precision metal cutting;Ikawa;Bull. Jpn. Soc. Precis. Eng.,1987

3. Ductile regime model for diamond turning of brittle materials;Blackley;J. Precis. Eng.,1991

4. Ductile-regime turning mechanism of single-crystal silicon;Shibata;J. Precis. Eng.,1996

5. Diamond turning of silicon substrates in ductile regime;Leung;J. Mater. Process. Technol.,1998

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