Convective cooling and optimal placement of electronic components with variable ambient temperature I. The linear model-Reference-Cited by-同舟云学术

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Convective cooling and optimal placement of electronic components with variable ambient temperature I. The linear model

Published:1993-09 Issue:3 Volume:47 Page:351-367
ISSN:0377-0427
Container-title:Journal of Computational and Applied Mathematics
language:en
Short-container-title:Journal of Computational and Applied Mathematics

Author:

Cahlon B.,Schochetman I.E.,Shillor M.

Publisher

Elsevier BV

Subject

Applied Mathematics,Computational Mathematics

Reference11 articles.

1. A model for the convective cooling of electronic components with application to optimal placement;Cahlon;Math. Comput. Modelling,1991

2. Optimal placement of heat sources on a rectangular grid;Cahlon;Math. Comput. Simulation,1992

3. Component-placement optimization for convectively cooled electronics;Dancer;IEEE Trans. Reliability,1989

4. Optimal allocation of heat sources on a planar printed circuit board;Gertsbakh;Proc. 12th IMACS Congress on Scientific Computation,1988

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