Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering-Reference-Cited by-同舟云学术

Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering

Published:2024-02 Issue: Volume:208 Page:113668
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Lu Xiao,Zhang Liang,Liu Zhi-Quan,Gao Li-Yin,Chen Chen,Wu Chuan-Jiang,Huang Xi,Deng Kai

Funder

Xiamen University of Technology

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Publisher

Elsevier BV

Reference25 articles.

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2. Study on the microstructure and mechanical property of cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering;Yi;J. Manuf. Process.,2021

3. Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain cu and ENIAg surface finish;Vidyatharran;J. Mater. Res. Technol-JMRT,2021

4. Study on the dual inhibition behavior of interfacial IMCs in cu/SAC105/cu joint by adopting SiC nanowires and nanocrystalline cu substrate;Lu;J. Mater. Res. Technol.,2023

5. Unidirectional growth of microbumps on (111)-oriented and Nanotwinned copper;Hsiao;Science,2012

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1. Effects of Mo nanoparticles on growth of compounds layer and strength of Sn3.0Ag0.5Cu/Cu solder joint during thermal cycling;Journal of Materials Science: Materials in Electronics;2024-07